September 26, 2019 electronics cooling innovative multiphysics technology furthers cadences expansion into fastgrowing system analysis and design market san jose, calif. The big 3 a comparison of electronics cooling cfd software. The component library in macroflow includes many electronics cooling components such as fan and pump, heat sink, cold plate, and heat exchanger, air filter, screen, and quick disconnect. Over the last 15 years, flexible graphite heat spreaders have largely replaced aluminum for thermal management in many advanced consumer electronics devices where. Cfd software predicts airflow and heat transfer, in and around electronic. Cooling solutions are fundamental to good electronics design and difficult to solve for many product developers, the temperature of their product is something that just happens. Cfd, fea and thermal simulation software for electronics. Welcome to part 3 of the blog covering the added capability the electronics cooling module offers to solidworks flow simulation. In part 2 we covered the creation of the more accurate pcb definition as well as the tworesistor component. Coolit is the leading cfd software for electronics. If you currently use or are considering flow simulation for electronics cooling analysis, you may be wondering, do i need the electronics cooling module. By scheduling a business process assessment today, we can learn more about your requirements. Improve electronics reliability with electronics cooling simulation and thermal.
Thermal analysis software and electronics cooling tes. Maxwell and q3d extractor into icepak for steadystate or transient thermal analysis. Electronics cooling ansys industry leading computational fluid dynamics cfd solutions, along with chiplevel thermal integrity simulation software, provide all you need to perform electronics cooling simulation and thermal analysis for chippackage, pcb and systems. The same concepts that are used in electronics cooling can be applied to find the heat loss by house walls or to find out the heat lost by a car engine. It supports more users, application examples, libraries and published technical papers than any competing product. Mechanical engineering, electronics cooling, cfd analys. See how engineers use autodesk cfd to solve electronics cooling issues. Heatdesigners performance is optimized for applications that do not require precise reproduction of fine geometrical curvature to predict an accurate flow field. Five electronics cooling simulation projects using cfd and conjugate heat transfer that you can use as templates to start your own analysis for free. Read on to see how these super powers will help you to overcome the top 5 challenges in electronics cooling.
Abstract this paper presents results of cfd analysis of an electronics cooling enclosure used as part. And, our testing continues to shape the future of f1 today. The most common heat pipe for electronics thermal management has a copper envelope and wick, with water as the working fluid. Electronics cooling fluid and thermal modeling for electronic design sindafluint has been widely used for thermal modeling of electronics in the aerospace industry for decades. Flotherm delivers rightbydesign products that save design time and. Act has worked on numerous applications that involve the spreading and dissipating of highly concentrated heat fluxes involved in power electronics. Flotherm electronics thermal analysis software mentor. Ansys industry leading computational fluid dynamics cfd solutions, along with chiplevel thermal integrity simulation software, provide all you need to perform electronics cooling simulation and thermal analysis for chippackage, pcb and systems. Analysis of fan curves and fan laws in thermal management of. Flotherm delivers rightbydesign products that save design time and reduce the need for physical prototyping from components and boards to complete systems and data. Electroflo is an electronics cooling package designed for high power density applications. Simscale is a 100% cloudbased cae software for electronics simulation that lets you test, validate, and optimize your designs through cfd, heat transfer, and thermal analysis. Electronics cooling software from the leader in electronics thermal analysis. Thermal spreading and more using opensource fea software june 16, 20 electronics cooling articles, design, software modeling the purpose of the present article is to suggest that accurate solution of thermal spreading problems for multilayer, edgetruncated geometry is easily accomplished using free, opensource finite element software.
Before making any comparisons to the three big electronics cooling cfd packages, a disclaimer is needed i am not a superuser of any of these software packages. Simulate, visualize and analyze airflow and thermal conditions to better optimize your product design. A total revision of the authors previous work, thermal computations for electronics. Thermal design tool for electronics heatdesigner uses core technology from scstream to perform thermal fluid analysis specifically designed for electronic cooling. These terms are listed below and defined for reference. Thermal management of electronics is a skill in great demand. Ansys software simulates the interactions between these components, and the design flow incorporates thermal and mechanical analysis for evaluating. Stateoftheart thermal analysis cfd computer software. Electronics and avionics cooling software for design and analysis including twophase flow and liquid cooling. Coolit is an advanced cfd thermal analysis software for. The challenge is further compounded by the relentless drive to reduce device size while increasing device power.
Cost reduction with increased thermal performance of communications module. Electronics cooling invites you to share your expertise, knowledge, and perspective on critical aspects, foundational education, and trends with electronics thermal management technology. Electronics cfd, fea and thermal analysis with simscale. Simulation platform offers new insight into electronics cooling. Applying this capability to electronics cooling challenges delivers amazing results. Electronics cooling analysis per industry standards. The icepak solver performs conduction, convection and radiation conjugate heat transfer analyses. Electronics cooling simulation and testing library. Utilize computational fluid dynamics cfd software analysis to pinpoint hotspots in the coldplate design and identify flow anomalies, such as recirculation flow, eddies and uneven flow through the cooling channels. Analysis of fan curves and fan laws in thermal management. Mjm engineering company is a full service engineering firm specialized in the cooling of electronics and telecommunication components and systems.
Our flagship product, coolit, has become the cfd software of choice for electronics cooling applications. A major challenge in the electronics industry is to ensure components operate at temperatures below their mandated limits. Simulation platform offers new insight into electronics. With the ability to visualize and analyze the airflow and thermal conditions of products, you can optimize the design accordingly. Electronics used within products are constantly changing and improving, but the need to ensure proper cooling of these components remains key to producing a successful product.
This lecture lists the important software available in the market that are used by thermal analyst. Historical context managing heat dissipation has for some time been recognised as one of the main factors limiting the pace of development in electronics the economist, 2003. Icepak combines advanced solver technology with robust, automatic meshing to help you rapidly perform heat transfer and fluid flow simulation for a wide variety of electronic applications including computers, telecommunications equipment. Focused on thermal management, tims, fans, heat sinks, cfd software, ledslighting.
Nanofluids in electronics cooling applications advanced. And were still innovating now, combining expertise and experience in electronics, hardware and software engineering to turn ideas into real world oem approved products. The company is a large software supplier to manufacturing companies, industrial design firms, aec and civil design firms, and the government. It is a fully featured and efficient thermal analysis software that combines the power of coupled thermalelectrical analysis with the easeofuse of an object oriented graphical user interface to provide solutions to challenging problems facing todays. Design and analysis of outdoor enclosure for fibertothehome and sonet telephony equipment. The company is continuing to invest heavily in electronics cooling through the acquisition of flomerics ltd to create mentors mechanical analysis division. Nov 18, 2009 6sigmaet, a cfdbased electronic cooling software package, has been introduced by future facilities inc. With mentors backing, substantial investments are continually made in electronics cooling software tool development. Bestofclass design and analysis software for vapor compression refrigeration cycles and other twophase systems such as spray cooling loops, immersion cooling systems, heat pipes, loop heat pipes, and. Automated test fixture high voltage and functional testing. Ansys icepak provides powerful electronic cooling solutions which utilize the industryleading ansys fluent computational fluid dynamics cfd solver for thermal and fluid flow analyses of integrated circuits ics, packages, printed circuit boards pcbs and electronic assemblies. However, as power ratings go up and feature size comes down there is a mounting problem for thermal management engineers and heatsink suppliers alike. How to use cfd analysis for electronics cooling i simscale. Jan 11, 2016 if you currently use or are considering flow simulation for electronics cooling analysis, you may be wondering, do i need the electronics cooling module.
Mar 10, 2017 cfd simulations of air velocity in a system with fans drawing air across highpowered components. Since the convective htc is inversely proportional to the hydraulic diameter of the channel, very high heat transfer. Flotherm uses advanced cfd techniques to predict airflow, temperature, and heat transfer in components, boards, and complete systems, including racks and data centers. Electronics cooling best practices cfd 2019 autodesk. There are several terms that are used in discussion nanoparticles and nanofluids in electronics cooling applications. Cdns today expanded its presence in the system analysis and design market with the introduction of the cadence. As component power increases and packaging sizes decreases, designing to ensure adequate cooling becomes increasingly critical and challenging. The new feature enables thermal performance analysis of board and systemlevel electronic components. This paper presents results of cfd analysis of an electronics cooling enclosure used as part of a larger telecommunication radar system. Solidworks flow simulation is a versatile tool and can provide valuable information for a wide range of electronics cooling scenarios without the electronics cooling module. Utilizing fan curves and fan laws enabled ats engineers to establish the parameters for a successful use of fans for cooling this system. Insufficient cooling can result in schedule delays, low reliability, and increased product costs, especially in todays highperformance devices where components are densely packed into eversmaller enclosures. Its also the industrys best solution for integration with mcad and eda software. People with interest in thermal analysis and thermal management.
Thermal spreading and more using opensource fea software. Thermal cooling for electronics archives eda direct. Electronics cooling simulation and testing training library offers a portfolio of learning paths for micred and the flotherm family of products. Oct 10, 2019 september 26, 2019 electronics cooling innovative multiphysics technology furthers cadences expansion into fastgrowing system analysis and design market san jose, calif. The component library in macroflow includes many electronicscooling components such as fan and pump, heat sink, cold plate, and heat exchanger, air filter, screen, and quick disconnect. Electronics cooling challenges autodesk cfd gives engineers the ability to see the invisible within their product designs.
If you have not done so yet, i recommend reading part 1 and part 2. Nov 09, 2017 before making any comparisons to the three big electronics cooling cfd packages, a disclaimer is needed i am not a superuser of any of these software packages. Proper thermal management of the entire design space is essential to delivering ontime, onbudget, reliable electronic products. With simscale, companies in the electronics industry can benefit from all the advantages of computer simulation, developing highquality products in a shorter time and with minimum investments. Thermal analysis software for electronics electroflo. Conductive, radiative, and convective air cooling is a versatile reference that was carefully designed to help readers master mathematical calculation, prediction, and application methods for conductive, radiative, and convective heat transfer in electronic equipment. Thermal software for heat sinks, circuit boards, enclosures. Online sources of information are available and a number of books have been published on this topic.
Pads electronics cooling analysis tools mentor graphics. Let our autodesk team of experts help you identify software tools that can assist you with your electronics cooling challenges. Electronics cooling analysis demonstration using flotherm. Electronics cooling simulation and testing library mentor. Download our electronics cooling guide to learn more about optimizing your design with online. Solidworks flow simulation electronics cooling part 3. Ansys icepak simulates electronics cooling strategies and overall electronic thermal. This course will be beneficial for anyone looking to pursue a career as a thermal analyst.
Electronics cooling encompasses thermal design, analysis and experimental characterization of electronic systems as a discrete discipline with the product creation process for an electronics product, or an electronics subsystem within a product e. Coolit is an advanced cfd thermal analysis software for electronics. Software package that includes icepak and additional capabilities. Ansys icepak is a powerful cae software tool that allows engineers to model electronic system designs, perform heat transfer and fluid flow simulations. Autodesk has software for electronics cooling simulation.
A cfd analysis of an electronics cooling enclosure for. Current trends in flexible graphite for cooling advanced consumer electronics abstract as we entered the current century, consumer electronics were primarily cooled using aluminum. Finally, in part 3 we talked about the use of heat pipes in electronics applications. Electronic cooling simulations using ansys icepak courses. Heatdesigner thermal design tool for electronics msc software. Base fluid fluids generally used to contain nano particles to create a colloidal suspension. Mar 26, 2019 so finally, the journey through the electronics cooling module of flow simulation is done.
Ansys electromechanical and power electronics simulation software is ideal for applications which depend on the robust integration of motors, sensors, and actuators with electronics controls. Coppermethanol is used if the heat pipe needs to operate below the freezing point of water, and aluminumammonia heat pipes are used for electronics cooling in space. The powerful flotherm suite of 3d computational fluid dynamics cfd software predicts airflow and heat transfer, in and around electronic equipment. Flotherm products 3d computational fluid dynamics cfd software. Electroflo is thermal analysis software designed exclusively for challenging electronics cooling and design issues.
Using simulation to design cooling systems for electronics webinar. Electronics cooling stands strong as one of the foremost resources for thermal management engineers and professionals, and much of this success is the result. Since macroflowbased analysis is very simple and fast, its use allows determination of a good system design early in the design cycle. Using simulation to design cooling systems for electronics. How to use cfd analysis for electronics cooling about this free webinar when it comes to electronics, neglecting to effectively cool a component within a system can lead to overheating, product lifespan reduction, and even operational failure. Electronics cooling solution liquid cooling passive. Software identifies the optimum thermal solution for managers.
On the face of it, electronics cooling sounds as if it should be a relatively simple application for cfd to handle. Flotherm is the undisputed world leader for electronics thermal analysis, with a 98 percent user recommendation rating. You can also conduct thermomechanical stress analysis and airflow analysis to. Oct 04, 2017 there are several terms that are used in discussion nanoparticles and nanofluids in electronics cooling applications. Heatdesigner uses core technology from scstream to perform thermal fluid analysis specifically designed for electronic cooling. In these previous blogs, we talked about joule heating, improved pcb definitions, two resistor components and more. Haddad2 1school of the built environment, university of nottingham, nottingham ng7 2rd, uk 2nuventix inc. The system level packaging of these products is complex and engineers have a difficult task understanding the products. Computational fluid dynamic thermal software helped model the initial cold plate prototype and identify potential hot spots. Engineers can rely on icepak for an integrated electronics cooling solution for electronic applications ranging in scale from individual ics to packages and pcbs, up to computer housings and entire data centers. It is a 3d conjugate heat transfer package with computational fluid dynamics cfd capabilities. Cfd analysis software, applied to the thermal design of electronics.
Applying six sigma principles to electronics cooling. Cfd simulations of air velocity in a system with fans drawing air across highpowered components. An original cooling enclosure was simulated using flotherm which results were taken as the benchmark thermal performance. The powerful flotherm suite of 3d computational fluid dynamics cfd software.
60 935 392 315 1138 1235 572 333 143 1294 1248 893 1013 1251 1464 393 1264 1259 1393 1368 1440 581 1433 286 120 739 400 28 1333 1327 787 1088 1216 373 205 1055 620 54 888 674